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http://repository.unmul.ac.id/handle/123456789/7337| Title: | Peer Review_Jurnal Nasional_Bohari_Decreased Level of Metal Ions of Copper (Cu) in The Electroplating Industry Waste Water Using Electrodeposition Method |
| Authors: | Yusuf, Bohari |
| Keywords: | Decreased Level of Metal Ions of Copper (Cu) in The Electroplating Industry Waste Water Using Electrodeposition Method |
| Issue Date: | Nov-2018 |
| Publisher: | Jurnal Kimia Mulawarman |
| Series/Report no.: | 16;1 |
| Abstract: | Decreased Level of Metal Ions of Copper (Cu) in The Electroplating Industry Waste Water Using Electrodeposition Method (Jurnal Kimia Mulawarman Vol.16 No.1, 60-65. 2018. ISSN 2476-9258) |
| Description: | Decreased Level of Metal Ions of Copper (Cu) in The Electroplating Industry Waste Water Using Electrodeposition Method (Jurnal Kimia Mulawarman Vol.16 No.1, 60-65. 2018. ISSN 2476-9258) |
| URI: | http://repository.unmul.ac.id/handle/123456789/7337 |
| ISSN: | 2476-9258 |
| Appears in Collections: | Peer Review |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| 40 Hasil review - Jurnal Nasional - Penurunan Kadar Ion Logam Tembaga pada Limbah Cair Industri.pdf | Decreased Level of Metal Ions of Copper (Cu) in The Electroplating Industry Waste Water Using Electrodeposition Method | 1.07 MB | Adobe PDF | View/Open |
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