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Please use this identifier to cite or link to this item: http://repository.unmul.ac.id/handle/123456789/7337
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dc.contributor.authorYusuf, Bohari-
dc.date.accessioned2021-10-10T11:05:48Z-
dc.date.available2021-10-10T11:05:48Z-
dc.date.issued2018-11-
dc.identifier.issn2476-9258-
dc.identifier.urihttp://repository.unmul.ac.id/handle/123456789/7337-
dc.descriptionDecreased Level of Metal Ions of Copper (Cu) in The Electroplating Industry Waste Water Using Electrodeposition Method (Jurnal Kimia Mulawarman Vol.16 No.1, 60-65. 2018. ISSN 2476-9258)en_US
dc.description.abstractDecreased Level of Metal Ions of Copper (Cu) in The Electroplating Industry Waste Water Using Electrodeposition Method (Jurnal Kimia Mulawarman Vol.16 No.1, 60-65. 2018. ISSN 2476-9258)en_US
dc.publisherJurnal Kimia Mulawarmanen_US
dc.relation.ispartofseries16;1-
dc.subjectDecreased Level of Metal Ions of Copper (Cu) in The Electroplating Industry Waste Water Using Electrodeposition Methoden_US
dc.titlePeer Review_Jurnal Nasional_Bohari_Decreased Level of Metal Ions of Copper (Cu) in The Electroplating Industry Waste Water Using Electrodeposition Methoden_US
dc.typeOtheren_US
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