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Peer Review_Jurnal Nasional_Bohari_Decreased Level of Metal Ions of Copper (Cu) in The Electroplating Industry Waste Water Using Electrodeposition Method

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Decreased Level of Metal Ions of Copper (Cu) in The Electroplating Industry Waste Water Using Electrodeposition Method (1.041Mb)
Date
2018-11
Author
Yusuf, Bohari
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Abstract
Decreased Level of Metal Ions of Copper (Cu) in The Electroplating Industry Waste Water Using Electrodeposition Method (Jurnal Kimia Mulawarman Vol.16 No.1, 60-65. 2018. ISSN 2476-9258)
URI
http://repository.unmul.ac.id/handle/123456789/7337
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Repository Universitas Mulawarman copyright ©   LP3M Universitas Mulawarman
Jalan Kuaro Kotak Pos 1068
Telp. (0541) 741118
Fax. (0541) 747479 - 732870
Samarinda 75119, Kalimantan Timur, Indonesia
Contact Us | Send Feedback