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dc.contributor.authorDayadi, Irvin
dc.date.accessioned2022-03-13T12:57:13Z
dc.date.available2022-03-13T12:57:13Z
dc.date.issued2021-12-07
dc.identifier.isbn978-623-5262-03-1
dc.identifier.urihttp://repository.unmul.ac.id/handle/123456789/25574
dc.description.abstractRice Husk in the form of particles is not utilized by the wood industry so it needs to be processed into particle board in order to provide added value and is economical. The purpose of this study was to determine the quality of the mechanical physical properties of particle board with cold-pressed urea formaldehyde adhesive and to determine the effect of the applied load and compression time on the quality of its mechanical physical particle board based on the JIS-A-5908 (2003) standard. The study used a factorial study with a completely randomized pattern followed by ANOVA and LSD tests (Least Significant Difference). The treatments used were compression load of 30 bar, 40 bar, 50 bar with a compression time of 1 hour, 2 hours, 3 hours. The results showed that the moisture content was quite uniform and had a very significant effect on the compression load on physical properties, namely density and thickness expansion, as well as on mechanical properties, namely Modulus of Elasticity (MoE), Modulus of Rupture (MoR), and Internal Bonding Strength (IBS). The significant effect on compression time is the Modulus of Rupture (MoR), and Internal Bonding Strength (IBS). However, the water absorption properties did not show a very significant or significant effect. The difference between the load and the best compression time on the mechanical physical properties of rice husk particle board with urea formaldehyde adhesive is with a compression load of 50 bar and a compression time of 3 hours. However, all physical mechanical tests meet the standards of JIS-A-5908 (2003).en_US
dc.publisherFakultas Kehutanan Universitas Mulawarmanen_US
dc.titlePENGARUH BEBAN DAN WAKTU KEMPA TERHADAP SIFAT FISIK DAN MEKANIK PAPAN PARTIKEL SEKAM PADI DENGAN PEREKAT UREA FORMALDEHID (UF)en_US


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